United Resin Corp

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Web: http://www.unitedresincorp.com
E-Mail:
Address: 4359 Normandy Court, Royal Oak, Michigan 48073, USA
Phone: +1-(800)-521-4757 | Fax: +1-(800)-549-9587 | Map/Directions >>

Profile: United Resin Corp provides potting & encapsulating, adhesive, tooling, structural and specialty electronic systems. Our electronic resins are used for potting and encapsulating coils, transformers, circuit boards, magnetic components, marine sonar & noise interference filters & surge protectors. Our light-weight syntactic epoxy dough replaces conventional and expensive tooling processes in either high or room temperature applications.

8 Products/Chemicals (Click for related suppliers)

• Adhesive Resins

• Coating Additives

• Coatings

IUPAC Name: butane-1,4-diol; 1-isocyanato-4-[(4-isocyanatocyclohexyl)methyl]cyclohexane; oxepan-2-one

Molecular Formula:	C₂₅H₄₂N₂O₆	Molecular Weight:	466.610780 [g/mol]
H-Bond Donor:	2	H-Bond Acceptor:	8

InChIKey: ZECDNEGVMOSZJI-UHFFFAOYSA-N

• Foam Products

• Ink and Coating Resins

IUPAC Name: 1-ethyl-4-[3-(1-ethylquinolin-4-ylidene)prop-1-enyl]quinolin-1-ium iodide

Molecular Formula:	C₂₅H₂₅IN₂	Molecular Weight:	480.383870 [g/mol]
H-Bond Donor:	0	H-Bond Acceptor:	2

InChIKey: CEJANLKHJMMNQB-UHFFFAOYSA-M

• Resins, Laminating

• Surface Coating Resins

• Surface Coatings

IUPAC Name: ethenol

Molecular Formula:	C₂H₄O	Molecular Weight:	44.052560 [g/mol]
H-Bond Donor:	1	H-Bond Acceptor:	1

InChIKey: IMROMDMJAWUWLK-UHFFFAOYSA-N