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Songzi Nanhai Chemical Co., Ltd.

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Web: http://www.nanhaichem.com
E-Mail:
Address: NO.35, Gongjiao Road, Nanhai town, Songzi, Hubei, China
Phone: +86-(716)-6640702 | Fax: +86-(716)-6640702 | Map/Directions >>

Profile: Songzi Nanhai Chemical Co., Ltd. specializes in the manufacture of high molecular synthetic materials, plastic additives, and fine chemical intermediates. Our main products are polyolefin nucleation transparent agent series, epoxy resin, curing agent series, and special-purpose phenolic resin series. Our polyolefin nucleation transparent agent is the derivative of dibenzylidene sorbitol. As a highly efficient nucleation transparent agent, it can improve the transparency of polyolefin products. It also can improve the smoothness, resistance to impact, and molding time. It is a white powder, without irritating odor. It can offer good operational conditions. It is a non-toxic material.

9 Products/Chemicals (Click for related suppliers)  
• Antioxidants: General
IUPAC Name: [(2R)-2,5,7,8-tetramethyl-2-[(4R,8R)-4,8,12-trimethyltridecyl]-3,4-dihydrochromen-6-yl] acetate

Molecular Formula: C31H52O3Molecular Weight: 472.742780 [g/mol]
H-Bond Donor: 0H-Bond Acceptor: 3

InChIKey: ZAKOWWREFLAJOT-CEFNRUSXSA-N

• Dispersants
• Epoxy Resin
IUPAC Name: 2-(chloromethyl)oxirane; 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol | CAS Registry Number: 25068-38-6
Synonyms: Genepoxide, Epidian, Epiterm, Epiterm W, Casting Resin F, Bakelite PAHJ, Bakelite PKDA, Bakelite PKHH, Araldite 527, Phenoxy PKHH, Epidian 1, Epidian 2, Epidian 3, Epidian 4, Epidian 5, Epiterm 1, Araldite GY 250, Beckopox EP 301, Beckopox EP 304, Araldit LY 556

Molecular Formula: C18H21ClO3Molecular Weight: 320.810540 [g/mol]
H-Bond Donor: 2H-Bond Acceptor: 3

InChIKey: KUBDPQJOLOUJRM-UHFFFAOYSA-N

• Epoxy Resin Curing Agents
• Flame Retardants
IUPAC Name: 1,2,3,5-tetrabromo-4-(2,4,5-tribromophenoxy)benzene

Molecular Formula: C12H3Br7OMolecular Weight: 722.483 [g/mol]
H-Bond Donor: 0H-Bond Acceptor: 1

InChIKey: ILPSCQCLBHQUEM-UHFFFAOYSA-N

• Phenolic Resin
IUPAC Name: 2-methoxy-6-methylphenol

Molecular Formula: C8H6O2Molecular Weight: 134.132040 [g/mol]
H-Bond Donor: 1H-Bond Acceptor: 2

InChIKey: KXGFMDJXCMQABM-UHFFFAOYSA-N

• Powder Coatings
• Ultraviolet Absorbers
• Urea Formaldehyde Resin
IUPAC Name: formaldehyde; urea | CAS Registry Number: 9011-05-6
Synonyms: Polynoxylin, Hygromull, Karbamol, Pianizol, Piatherm, Ponoxylan, Gabrite, Piatherm D, Plastopal BT, Uramite, Resina X, Karbamol B/M, Uformite 700, Kauresin K244, Polyoxymethylene urea, Resamin 155F, Uformite F 240N, Uloid 22, Kaurit 420, KM 2 (Polymer)

Molecular Formula: C2H6N2O2Molecular Weight: 90.081240 [g/mol]
H-Bond Donor: 2H-Bond Acceptor: 2

InChIKey: ODGAOXROABLFNM-UHFFFAOYSA-N


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