Nan Pao Group

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Contact: Elvis Wu - Marketing Manager
Web: http://www.nanpao.com
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Address: Room 13, 10/F, Block B,Tonic Industrial Centre,19 Lam Hing, Kowloon Bay, Hong Kong
Phone: +852-(2331)-3983-3984 | Map/Directions >>

Profile: Nan Pao Group is engaged in manufacturing of adhesives, coatings, chemical resins and special chemical products. Our product line includes PVAC resins, EVA resins, acrylates, PU resins, phenolic resins, epoxy resins, water-proof resin/materials and adhesives for sport appliance. Our PU resin is good at resisting of bending, grinding, chemicals, solvents, dirt or water. Our PU resins are used as a adhesives for cloth or dual lock and moisture curing adhesive.

5 Products/Chemicals (Click for related suppliers)

• Acrylates

IUPAC Name: ethenyl acetate; 2-ethylhexyl prop-2-enoate

Molecular Formula:	C₁₅H₂₆O₄	Molecular Weight:	270.364540 [g/mol]
H-Bond Donor:	0	H-Bond Acceptor:	4

InChIKey: RAEGHCPKKXGGQN-UHFFFAOYSA-N

• Adhesive Resins

• Epoxy Resin

IUPAC Name: 2-(chloromethyl)oxirane; 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol | CAS Registry Number: 25068-38-6
Synonyms: Genepoxide, Epidian, Epiterm, Epiterm W, Casting Resin F, Bakelite PAHJ, Bakelite PKDA, Bakelite PKHH, Araldite 527, Phenoxy PKHH, Epidian 1, Epidian 2, Epidian 3, Epidian 4, Epidian 5, Epiterm 1, Araldite GY 250, Beckopox EP 301, Beckopox EP 304, Araldit LY 556

Molecular Formula:	C₁₈H₂₁ClO₃	Molecular Weight:	320.810540 [g/mol]
H-Bond Donor:	2	H-Bond Acceptor:	3

InChIKey: KUBDPQJOLOUJRM-UHFFFAOYSA-N

• Phenol Formaldehyde Resin

IUPAC Name: 2-methoxy-6-methylphenol | CAS Registry Number: 9003-35-4
Synonyms: 6-Methylguaiacol, 2-Methoxy-6-methylphenol, Phenol-formaldehyde resin, Formaldehyde, phenol polymer, Phenol, formaldehyde polymer, ghl.PD_Mitscher_leg0.672, Phenol, 2-methoxy-6-methyl-, Paraformaldehyde, phenol polymer, PHENOL FORMALDEHYDE RESIN, NSC7374, Phenol, polymer with formaldehyde, NSC 7374, SBB008271, ZINC00039710, FR-1146, Paraformaldehyde, formaldehyde, phenol polymer, 2896-67-5

Molecular Formula:	C₈H₁₀O₂	Molecular Weight:	138.163800 [g/mol]
H-Bond Donor:	1	H-Bond Acceptor:	2

InChIKey: WBHAUHHMPXBZCQ-UHFFFAOYSA-N

• Resins For Glues And Adhesives