Epoxy Resin Application Technology Service Center

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Web: http://www.epoxyresin.com.cn
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Address: Application service center, Epoxy Resin Division, Baling Petrochemical, Yueyang Bldg,, Hunan Province 414014, China
Phone: +86-(730)-8493444 | Fax: +86-(730)-8482376 | Map/Directions >>

Profile: Epoxy Resin Application Technology Service Center is a petrochemical enterprise integrating the production of chloro-alkali, epoxy resin, and organic chlorine products. Our liquid BPA epoxy resin is a type of basic epoxy resin. It is a colorless, and light yellow viscous liquid with low toxicity. It is mainly used in coating, adhesive, antisepticising, electric insulation, for laminated plates and potting fields, as well as the raw material for high-grade epoxy resin processing. Our functional epoxy resin is light yellow with low toxicity, and is characterized by higher softening point with wide molecule weight distribution. It is a high-molecule-weight compound of even polymerization degree. The products made from this material have stronger impact resistance and flexibility. It is mainly used in coating and painting business.

10 Products/Chemicals (Click for related suppliers)

• Beta Chlorine

IUPAC Name: molecular chlorine | CAS Registry Number: 7782-50-5
Synonyms: CHLORINE, dichlorine, Bertholite, Chlorine gas, Molecular chlorine, Chlore [French], Cloro [Italian], Chlorine mol, Chloor [Dutch], Chlor [German], Chlorine mol., Chlorinated water, Caswell No. 179, Bertholite /warfare gas/, Chlorinated water (chlorine), CCRIS 2280, HSDB 206, 295132_ALDRICH, CHEBI:29310, EINECS 231-959-5

Molecular Formula:	Cl₂	Molecular Weight:	70.906000 [g/mol]
H-Bond Donor:	0	H-Bond Acceptor:	0

InChIKey: KZBUYRJDOAKODT-UHFFFAOYSA-N

• Bisphenol A Epoxy Resin

IUPAC Name: 2-[[4-(oxiran-2-ylmethoxy)-2-prop-1-en-2-ylphenoxy]methyl]oxirane | CAS Registry Number: 25085-99-8

Molecular Formula:	C₁₅H₁₈O₄	Molecular Weight:	262.305 [g/mol]
H-Bond Donor:	0	H-Bond Acceptor:	4

InChIKey: LKHYKYOGEUHBIW-UHFFFAOYSA-N

• Curing Agents

• Curing Agents, Epoxy Resins

• Diluents

• EP(EPOXY RESIN) (CAS: 38891-59-7)

• Epoxy Resin

IUPAC Name: 2-(chloromethyl)oxirane; 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol | CAS Registry Number: 25068-38-6
Synonyms: Genepoxide, Epidian, Epiterm, Epiterm W, Casting Resin F, Bakelite PAHJ, Bakelite PKDA, Bakelite PKHH, Araldite 527, Phenoxy PKHH, Epidian 1, Epidian 2, Epidian 3, Epidian 4, Epidian 5, Epiterm 1, Araldite GY 250, Beckopox EP 301, Beckopox EP 304, Araldit LY 556

Molecular Formula:	C₁₈H₂₁ClO₃	Molecular Weight:	320.810540 [g/mol]
H-Bond Donor:	2	H-Bond Acceptor:	3

InChIKey: KUBDPQJOLOUJRM-UHFFFAOYSA-N

• Petrochemical Additive

• Petrochemicals

IUPAC Name: benzene

Molecular Formula:	C₆H₆	Molecular Weight:	78.111840 [g/mol]
H-Bond Donor:	0	H-Bond Acceptor:	0

InChIKey: UHOVQNZJYSORNB-UHFFFAOYSA-N

• Phenolic Resin

IUPAC Name: 2-methoxy-6-methylphenol

Molecular Formula:	C₈H₆O₂	Molecular Weight:	134.132040 [g/mol]
H-Bond Donor:	1	H-Bond Acceptor:	2

InChIKey: KXGFMDJXCMQABM-UHFFFAOYSA-N