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A Erzi Chemical Co., Ltd.

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Web: http://www.aerzi.com
E-Mail:
Address: 1890 West Avenue, Wuxi Taihu Lake Pearl Building, No. 906, Wuxi, Jiangsu 214072, China
Phone: +86-(510)-85425373 | Fax: +86-(510)-85425113 | Map/Directions >>

Profile: A Erzi Chemical Co., Ltd. specializes in the field of chemical corrosion, corrosion-resistant professional series resins, and additives. Our main varieties are furan, phenolic, and vinyl ester resin, epoxy resin series, epoxy coating series, toughened resin series, hardener series, and thinner series. Our epoxy reactive diluent is used to make adhesives, electrical insulating resin cast parts, potting material, to make thick paste coating, solvent-free coatings, and floor coatings. We offer phenolic resin which is used to increase the heat level or corrosion resistance of the coatings, adhesives, casting materials, and laminated products.

8 Products/Chemicals (Click for related suppliers)  
• Curing Agents
• Epoxy Resin
IUPAC Name: 2-(chloromethyl)oxirane; 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol | CAS Registry Number: 25068-38-6
Synonyms: Genepoxide, Epidian, Epiterm, Epiterm W, Casting Resin F, Bakelite PAHJ, Bakelite PKDA, Bakelite PKHH, Araldite 527, Phenoxy PKHH, Epidian 1, Epidian 2, Epidian 3, Epidian 4, Epidian 5, Epiterm 1, Araldite GY 250, Beckopox EP 301, Beckopox EP 304, Araldit LY 556

Molecular Formula: C18H21ClO3Molecular Weight: 320.810540 [g/mol]
H-Bond Donor: 2H-Bond Acceptor: 3

InChIKey: KUBDPQJOLOUJRM-UHFFFAOYSA-N

• Epoxy Resins, Epoxy Esters And Reactive Diluents
• Furan
IUPAC Name: furan | CAS Registry Number: 110-00-9
Synonyms: FURAN, Divinylene oxide, Oxole, Furfuran, Tetrole, Axole, Oxacyclopentadiene, Furane, RCRA waste no. U124, RCRA waste number U124, 1,4-Epoxy-1,3-butadiene, HSDB 89, CCRIS 3159, 185922_ALDRICH, NCI-C56202, CHEBI:35559, EINECS 203-727-3, UN2389, BRN 0103221, LS-495

Molecular Formula: C4H4OMolecular Weight: 68.073960 [g/mol]
H-Bond Donor: 0H-Bond Acceptor: 1

InChIKey: YLQBMQCUIZJEEH-UHFFFAOYSA-N

• Phenolic Resin
IUPAC Name: 2-methoxy-6-methylphenol

Molecular Formula: C8H6O2Molecular Weight: 134.132040 [g/mol]
H-Bond Donor: 1H-Bond Acceptor: 2

InChIKey: KXGFMDJXCMQABM-UHFFFAOYSA-N

• Polyamide Resins (CAS: 68410-23-1)
• Unsaturated Polyester Resins
• Vinyl Ester Resin

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